公开(公告)号：US20240389217A1

公开(公告)日：2024-11-21

申请号：US18786783

申请日：2024-07-29

Applicant: InnoLight Technology PTE. LTD.

Inventor： Long CHEN ,  Yuzhou SUN ,  Dengqun YU

IPC: H05K1/02 ,  G02B6/42

Abstract: An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.

公开(公告)号：US20230117778A1

公开(公告)日：2023-04-20

申请号：US18069285

申请日：2022-12-21

Applicant: InnoLight Technology PTE. LTD.

Inventor： Yuzhou SUN ,  Long CHEN ,  Dengqun YU ,  Weilong LEE

IPC: G02B6/42

Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

公开(公告)号：US20220369450A1

公开(公告)日：2022-11-17

申请号：US17815714

申请日：2022-07-28

Applicant: InnoLight Technology PTE. LTD.

Inventor： Long CHEN ,  Yuzhou SUN ,  Dengqun YU

IPC: H05K1/02 ,  G02B6/42

Abstract: An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.

公开(公告)号：US20240421561A1

公开(公告)日：2024-12-19

申请号：US18817525

申请日：2024-08-28

Applicant: INNOLIGHT TECHNOLOGY PTE. LTD.

Inventor： Liang LUO ,  Wenkai TU ,  Jinan GU ,  Yuzhou SUN

IPC: H01S5/0687 ,  H01S3/139 ,  H01S5/02208 ,  H01S5/02251 ,  H01S5/02325 ,  H01S5/024 ,  H01S5/10 ,  H01S5/14

Abstract: An optical module includes an outer housing; and a module circuit board, a controller, a photonic integrated circuit and a tunable laser that are disposed in the outer housing. The tunable laser includes a sealed housing having an optical interface and an electrical interface, and a free-space external cavity laser disposed in the sealed housing and configured to emit an optical signal whose wavelength is tunable. The free-space external cavity laser includes an external resonant cavity formed of a first cavity surface and a second cavity surface, and a gain chip, a collimating lens, and a tunable filter assembly that are disposed between the first cavity surface and the second cavity surface.