公开(公告)号：US20160087376A1

公开(公告)日：2016-03-24

申请号：US14492967

申请日：2014-09-22

Applicant: INTEL CORPORATION

Inventor： CHUNG-HAO CHEN ,  YUN LING ,  XIANG LI

IPC: H01R13/652 ,  H01R13/6597

CPC classification number: H01R12/79 ,  H01R13/6584 ,  H01R13/6592

Abstract: Techniques for signal grounding are described herein. The techniques include a conductive element conductively coupled to an exposed ground pad of a circuit board. The conductive element is to conductively couple to a shield of a signaling link, and thereby conductively coupling the shield to the exposed ground pad.

Abstract translation: 本文描述了用于信号接地的技术。 这些技术包括导电元件与导电板的暴露的接地焊盘导电耦合。 导电元件导电地耦合到信令链路的屏蔽，从而导电地将屏蔽耦合到暴露的接地焊盘。