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公开(公告)号:US10396038B2
公开(公告)日:2019-08-27
申请号:US15505901
申请日:2014-09-26
Applicant: INTEL CORPORATION
Inventor: Bok Eng Cheah , Jackson Chung Peng Kong , Shanggar Periaman , Michael Skinner , Yen Hsiang Chew , Kheng Tat Mar , Ridza Effendi Abd Razak , Kooi Chi Ooi
IPC: H01L25/10 , H01L23/538 , H01L23/495 , H01L25/065 , H01L23/00 , H01L23/373 , H01L23/498 , H01L21/48
Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.