公开(公告)号：US10396038B2

公开(公告)日：2019-08-27

申请号：US15505901

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Shanggar Periaman ,  Michael Skinner ,  Yen Hsiang Chew ,  Kheng Tat Mar ,  Ridza Effendi Abd Razak ,  Kooi Chi Ooi

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48

Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.