公开(公告)号：US20180012834A1

公开(公告)日：2018-01-11

申请号：US15203718

申请日：2016-07-06

Applicant: INTEL CORPORATION

Inventor： Ke WANG ,  Xingjian CAI ,  Mohammad Ibrahim KHAN ,  Yun JI

IPC: H01L23/528 ,  H01L49/02

CPC classification number: H01L23/528 ,  H01L23/642 ,  H01L23/66 ,  H01L28/40 ,  H01L2223/6638 ,  H01L2223/6655 ,  H01L2924/15192

Abstract: Techniques and mechanism to provide signal communication with vias variously extending in a substrate. In an embodiment, a first capacitor and a second capacitor are coupled in parallel with one another each between a first via and a second via, the first via to receive a first signal. Respective portions of the first signal are concurrently communicated from the first via to the second via with the first capacitor and the second capacitor, respectively. In another embodiment, the first signal is one signal of a differential signal pair further comprising a second signal which is received at a third via. Respective portions of the second signal are concurrently communicated from the third via to a fourth via with a third capacitor and a fourth capacitor, respectively. The third capacitor and the fourth capacitor are coupled in parallel with one another each between the third via and the fourth via.