公开(公告)号：US20240072800A1

公开(公告)日：2024-02-29

申请号：US18446325

申请日：2023-08-08

Applicant: INTERLINK ELECTRONICS, INC.

Inventor： Gene Chen

IPC: H03K17/96

CPC classification number: H03K17/964 ,  H03K17/962 ,  H03K17/9645 ,  H03K2017/9604

Abstract: A sensing device may include a first sensor of a first type. The first sensor may include a first conductive element, a second conductive element, and a reactive material between the first conductive element and the second conductive element. The sensing device further including a second sensor of a second type that may be different from the first type. The second sensor may use the first conductive element as a conductive element in the second sensor.

公开(公告)号：US20230304875A1

公开(公告)日：2023-09-28

申请号：US18187655

申请日：2023-03-21

Applicant: INTERLINK ELECTRONICS, INC.

Inventor： Gene Chen ,  Shengi Geng ,  Declan Flannery

IPC: G01L5/00

CPC classification number: G01L5/0038

Abstract: A force sensing device may include a plate and a sensor plate. The sensor plate may be a first surface coupled to the plate and a second surface opposite the first surface. The sensor plate may also include an actuation structure coupled to the second surface and extending away from the second surface of the sensor plate. The force sensing device may further include a sensor aligned with the sensor plate such that a first force applied to the plate causes the actuation structure to directly contact and apply a second force to the sensor. The force sensing device may be used to determine a location, a magnitude, and/or an angle of the force applied on the plate.