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公开(公告)号：US20250087472A1
公开(公告)日：2025-03-13
申请号：US18367759
申请日：2023-09-13
Applicant: INTEVAC, INC.
Inventor： Samuel D. Harkness, IV , James Sullivan , Eric C. Lawson
Abstract: In an apparatus and related method, a substrate that has multiple facets is held in a chamber of a plasma reactor that has multiple plasma cavities. The substrate is positioned by a transport arrangement with each plasma cavity of the plasma reactor aligned to a facet of the substrate. A plasma is generated in each plasma cavity, to apply simultaneous plasma processing to multiple facets of the substrate.
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