Non-contact microelectronic device inspection systems and methods
    1.
    发明授权
    Non-contact microelectronic device inspection systems and methods 有权
    非接触式微电子器件检测系统及方法

    公开(公告)号:US08661905B2

    公开(公告)日:2014-03-04

    申请号:US12942047

    申请日:2010-11-09

    IPC分类号: G01N29/04

    摘要: Non-contact microelectronic device inspection systems and methods are discussed and provided. Some embodiments include a method of generating a virtual reference device (or chip). This approach uses a statistics to find devices in a sample set that are most similar and then averages their time domain signals to generate the virtual reference. Signals associated with the virtual reference can then be correlated with time domain signals obtained from the packages under inspection to obtain a quality signature. Defective and non-defective devices are separated by estimating a beta distribution that fits a quality signature histogram of inspected packages and determining a cutoff threshold for an acceptable quality signature. Other aspects, features, and embodiments are also claimed and described.

    摘要翻译: 讨论和提供非接触式微电子器件检查系统和方法。 一些实施例包括生成虚拟参考设备(或芯片)的方法。 该方法使用统计信息来查找最相似的样本集中的设备,然后对其时域信号进行平均以生成虚拟参考。 然后可以将与虚拟参考相关联的信号与从被检查的包获得的时域信号相关以获得质量签名。 通过估计匹配检查包的质量签名直方图的β分布并确定可接受的质量签名的截止阈值来分离有缺陷和无缺陷的设备。 还要求和描述其它方面,特征和实施例。

    Non-Contact Microelectronic Device Inspection Systems And Methods
    2.
    发明申请
    Non-Contact Microelectronic Device Inspection Systems And Methods 有权
    非接触式微电子器件检测系统及方法

    公开(公告)号:US20120111115A1

    公开(公告)日:2012-05-10

    申请号:US12942047

    申请日:2010-11-09

    IPC分类号: G01N29/04

    摘要: Non-contact microelectronic device inspection systems and methods are discussed and provided. Some embodiments include a method of generating a virtual reference device (or chip). This approach uses a statistics to find devices in a sample set that are most similar and then averages their time domain signals to generate the virtual reference. Signals associated with the virtual reference can then be correlated with time domain signals obtained from the packages under inspection to obtain a quality signature. Defective and non-defective devices are separated by estimating a beta distribution that fits a quality signature histogram of inspected packages and determining a cutoff threshold for an acceptable quality signature. Other aspects, features, and embodiments are also claimed and described.

    摘要翻译: 讨论和提供非接触式微电子器件检查系统和方法。 一些实施例包括生成虚拟参考设备(或芯片)的方法。 该方法使用统计信息来查找最相似的样本集中的设备,然后对其时域信号进行平均以生成虚拟参考。 然后可以将与虚拟参考相关联的信号与从被检查的包获得的时域信号相关以获得质量签名。 通过估计匹配检查包的质量签名直方图的β分布并确定可接受的质量签名的截止阈值来分离有缺陷和无缺陷的设备。 还要求和描述其它方面,特征和实施例。