公开(公告)号：US20180040798A1

公开(公告)日：2018-02-08

申请号：US15721743

申请日：2017-09-30

Applicant: Industrial Technology Research Institute

Inventor： Li-Ling Liao ,  Ming-Ji Dai ,  Chun-Kai Liu ,  Cheng-Heng Kao ,  Cheng-Chieh Li ,  Jeffrey Snyder ,  Fivos Drymiotis

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

公开(公告)号：US20160163950A1

公开(公告)日：2016-06-09

申请号：US14562784

申请日：2014-12-08

Applicant: Industrial Technology Research Institute

Inventor： Li-Ling Liao ,  Ming-Ji Dai ,  Chun-Kai Liu ,  Cheng-Heng Kao ,  Cheng-Chieh Li ,  Jeffrey Snyder ,  Fivos Drymiotis

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

Abstract translation: 提供了包括至少一个基板，热电元件和绝缘保护结构的热电模块的结构。 热电装置设置在基板上。 绝缘保护结构围绕热电装置。 热电装置包括至少三个电极板，第一类型和第二类型热电材料和扩散阻挡结构。 三个电极板中的第一和第二电极板设置在基板上。 第一类型热电材料设置在第一电极板上。 第二种热电材料设置在第二电极板上。 三个电极板中的第三电极板设置在第一类型和第二类型热电材料上。 扩散阻挡结构设置在第一类型和第二类型热电材料中的每一个的两个端子上。 还提供了上述热电模块的制造方法。