公开(公告)号：US20200052243A1

公开(公告)日：2020-02-13

申请号：US16379815

申请日：2019-04-10

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yung-Hui Yeh ,  Jui-Chang Chuang ,  Li-Ching Wang ,  Cheng-Yueh Chang ,  Chyi-Ming Leu ,  Shih-Ming Chen

IPC: H01L51/52 ,  H01L23/29 ,  G02B1/14

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

公开(公告)号：US10964912B2

公开(公告)日：2021-03-30

申请号：US16379815

申请日：2019-04-10

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yung-Hui Yeh ,  Jui-Chang Chuang ,  Li-Ching Wang ,  Cheng-Yueh Chang ,  Chyi-Ming Leu ,  Shih-Ming Chen

IPC: H01L51/52 ,  H01L23/29 ,  G02B1/14 ,  H01L27/32

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

公开(公告)号：US20250126722A1

公开(公告)日：2025-04-17

申请号：US18916714

申请日：2024-10-16

Applicant: Industrial Technology Research Institute

Inventor： Chieh-Wei Feng ,  Cheng-Yueh Chang ,  Tai-Jui Wang

IPC: H05K3/40 ,  H05K1/11 ,  H05K1/18

Abstract: A circuit compensation method applied to pattern displacement includes: disposing at least one chip on a carrier; measuring a shift of the chip, performing circuit position compensation on a predetermined pattern of a redistribution layer, and calculating a resistance difference of the pattern before and after the circuit position compensation; estimating a circuit proportion and a range of resistance variation in the pattern needed for resistance compensation after the circuit position compensation according to the resistance difference; determining a compensation position and a scheme of circuit proportion and adjusting a circuit width, area, length, pattern, or combination thereof of a circuit within the circuit proportion according to the resistance difference; outputting a picture file of the pattern after the circuit position and resistance compensation; and forming the redistribution layer according to the picture file and electrically connecting the redistribution layer to the chip. A circuit structure is also provided.