公开(公告)号：US20240080984A1

公开(公告)日：2024-03-07

申请号：US18149660

申请日：2023-01-03

Applicant: Industrial Technology Research Institute

Inventor： Yu-Wei Huang ,  Ching-Feng Yu ,  Chih-Cheng Hsiao

IPC: H05K1/18 ,  H01L23/538 ,  H01L25/065

CPC classification number: H05K1/181 ,  H01L23/5385 ,  H01L25/0655 ,  H01L24/16

Abstract: A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.