公开(公告)号：US09796874B2

公开(公告)日：2017-10-24

申请号：US14534233

申请日：2014-11-06

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Wei Chen ,  Sin-An Chen ,  Chuan-Hsu Fu ,  Li-Ching Wang ,  Yi-Ling Chen

IPC: C09D133/14 ,  C09D133/06

CPC classification number: C09D133/14 ,  C08L2312/00 ,  C09D133/06

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.