公开(公告)号：US20020189380A1

公开(公告)日：2002-12-19

申请号：US09880971

申请日：2001-06-15

申请人： Industrial Technology Research Institute

发明人： Weng-Jung Lu ,  Chin-Yuan Liu ,  Yuan-Tsu Wan ,  Chun-Kuei Lai ,  Chao-Hsien Huang ,  Chih-Min Lin ,  Chun-Hsien Liu

IPC分类号： F16H021/00

CPC分类号： F16H37/14 ,  H01L21/67144 ,  Y10T74/18024 ,  Y10T74/18032 ,  Y10T74/18216 ,  Y10T74/18232 ,  Y10T74/20305

摘要： The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above. The second driving device drives gear set, which utilizes the rotation of gear set to complete the actions of moving forth toward a non-horizontal direction and back toward the reverse direction as mentioned above.

摘要翻译： 本发明是用于快速取出和放入的装置，特别是装置可以从晶片快速取出芯片以放入另一个芯片插座，其中，本发明包括一个齿轮组，其包括第一大齿轮， 第二大齿轮和小齿轮; 至少两个驱动装置，其包括第一驱动装置和第二驱动装置; 连杆机构与齿轮组配合，以使连杆机构向非水平方向前进并朝向相反方向移动，并向着不垂直方向向下移动，朝向相反方向向上移动; 然后驱动由第一驱动装置驱动的升降机构和具有齿轮组和连杆机构的模板，以完成如上所述的向非垂直方向向下移动的向上的方向。 第二驱动装置驱动齿轮组，其利用齿轮组的旋转来完成如上所述的朝向非水平方向向前移动并朝向相反方向的动作。