公开(公告)号：US20240088130A1

公开(公告)日：2024-03-14

申请号：US17941901

申请日：2022-09-09

Applicant: Infineon Technologies AG

Inventor： Benedikt Kindl ,  Juliane Laurer ,  Max Stelzer ,  Vadim Valentinovic Vendt

IPC: H01L27/02 ,  H01L23/528

CPC classification number: H01L27/0248 ,  H01L23/528 ,  H01L23/5226

Abstract: A semiconductor device includes a semiconductor body having an upper surface, a group of first upper-level metal fingers and second upper-level metal fingers that are arranged alternatingly with one another, wherein each of the first upper-level metal fingers is electrically connected to the semiconductor body by the first lower-level conductive fingers, wherein each of the second upper-level metal fingers is electrically connected to the semiconductor body by the second lower-level conductive fingers, wherein the group of first lower-level conductive fingers and second lower-level conductive fingers defines a connection area over the upper surface, and wherein in the connection area the first upper-level metal fingers are at least partially non-overlapping with the second upper-level metal fingers.