公开(公告)号：US20230165082A1

公开(公告)日：2023-05-25

申请号：US17938462

申请日：2022-10-06

Applicant: Infineon Technologies AG

Inventor： Matthias Markert ,  Cornelius Fuchs ,  Jakob Kriz

IPC: H01L27/32

CPC classification number: H01L27/3276 ,  H01L2227/323

Abstract: A substrate arrangement for a micro display including a semiconductor substrate, a back end of line (BEOL) stack on the semiconductor substrate and wherein the BEOL stack comprises structured wiring layers, an insulating material structure (IMS), and a recess in the IMS, wherein the structured wiring layers are stacked and embedded in the insulating material structure, and wherein an upmost structured wiring layer of the structured wiring layers includes contact pads, and wherein the recess extends to a first set of contact pads; and a conductive layer on the surface of the BEOL stack, wherein the conductive layer includes a first portion including a contact pad array and wherein the conductive layer includes a second portion that is arranged on the first set of contact pads of the BEOL stack, and wherein the first portion of the conductive layer is electrically separated from the second portion of the conductive layer.