公开(公告)号：US20210253421A1

公开(公告)日：2021-08-19

申请号：US17248799

申请日：2021-02-08

Applicant: Infineon Technologies AG

Inventor： Andre BROCKMEIER ,  Markus BERGMEISTER ,  Bernhard GOLLER ,  Daniel PIEBER ,  Sokratis SGOURIDIS

IPC: B81C1/00

Abstract: A method for producing MEMS components comprises generating a carrier having a plurality of recesses. An adhesive structure is arranged on the carrier and in the recesses. A semiconductor wafer is generated, which has a plurality of MEMS structures arranged at the first main surface of the semiconductor wafer. The adhesive structure is attached to the first main surface of the semiconductor wafer, with the recesses being arranged above the MEMS structures and the adhesive structure not contacting the MEMS structures. The semiconductor wafer is singulated into a plurality of MEMS components by applying a mechanical dicing process.