公开(公告)号：US20230178428A1

公开(公告)日：2023-06-08

申请号：US17543199

申请日：2021-12-06

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Fee Hoon Wendy Wong ,  Thomas Behrens ,  Eric Lopez Bonifacio ,  Chau Fatt Chiang ,  Irmgard Escher-Poeppel ,  Giovanni Ragasa Garbin ,  Martin Gruber ,  Tien Shyang Law ,  Mohamad Azian Mohamed Azizi ,  Si Hao Vincent Yeo

IPC: H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L21/76838 ,  H01L21/563 ,  H01L23/31 ,  H01L21/4839

Abstract: A method includes providing a lead frame with a central metal plate and a plurality of leads extending away from the central metal plate, the central metal plate including an upper surface that includes a first mesa that is elevated from recessed regions, mounting a semiconductor die on the upper surface of central metal plate such that a lower surface of the semiconductor die is at least partially disposed on the first mesa, forming electrical interconnections between terminals of the semiconductor die and the leads, forming an encapsulant body on the central metal plate such that the semiconductor die is encapsulated by the encapsulant body and such that the leads protrude out from edge sides of the encapsulant body, and thinning the central metal plate from a rear surface of the central metal plate so as to isolate the first mesa at a lower surface of the encapsulant body.

公开(公告)号：US20200343166A1

公开(公告)日：2020-10-29

申请号：US16394557

申请日：2019-04-25

Applicant: Infineon Technologies AG

Inventor： Eric Lopez Bonifacio ,  Thorsten Hinderer ,  Fortunato Lopez ,  Norliza Morban

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00 ,  H01L21/56

Abstract: A lead frame includes a first die paddle, a second die paddle, a first lead, a second lead, and a third lead. The first lead is coupled to a first side of the first die paddle. The second lead is coupled to a second side of the first die paddle opposite to the first side of the first die paddle. The third lead is coupled to a first side of the second die paddle. At least one of the first lead, the second lead, and the third lead is coupled to the corresponding die paddle via a zigzag shaped tie bar.

公开(公告)号：US11152288B2

公开(公告)日：2021-10-19

申请号：US16394557

申请日：2019-04-25

Applicant: Infineon Technologies AG

Inventor： Eric Lopez Bonifacio ,  Thorsten Hinderer ,  Fortunato Lopez ,  Norliza Morban

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

Abstract: A lead frame includes a first die paddle, a second die paddle, a first lead, a second lead, and a third lead. The first lead is coupled to a first side of the first die paddle. The second lead is coupled to a second side of the first die paddle opposite to the first side of the first die paddle. The third lead is coupled to a first side of the second die paddle. At least one of the first lead, the second lead, and the third lead is coupled to the corresponding die paddle via a zigzag shaped tie bar.