公开(公告)号：US12283538B2

公开(公告)日：2025-04-22

申请号：US17740413

申请日：2022-05-10

Applicant: Infineon Technologies AG

Inventor： Marcus Boehm ,  Michael Fuegl ,  Ludwig Heitzer ,  Stefan Woetzel

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A molded semiconductor package includes: a mold compound; a metal substrate partly embedded in the mold compound; at least one first metal lead partly embedded in the mold compound; an inlay embedded in the mold compound, the inlay comprising a semiconductor die embedded in an electrically insulating body, a first metal structure attached to a first side of the semiconductor die, and a second metal structure attached to a second side of the semiconductor die; and a metal clip at least partly embedded in the mold compound and connecting the second metal structure to the at least one first metal lead. The semiconductor die has a maximum junction temperature higher than a glass transition temperature of the mold compound, the electrically insulating body has a glass transition temperature at or above the maximum junction temperature of the semiconductor die, and the metal substrate is attached to the first metal structure.

公开(公告)号：US12165959B2

公开(公告)日：2024-12-10

申请号：US17150739

申请日：2021-01-15

Applicant: Infineon Technologies AG

Inventor： Frank Singer ,  Marcus Boehm ,  Andreas Grassmann ,  Martin Gruber ,  Uwe Schindler

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

公开(公告)号：US20230369177A1

公开(公告)日：2023-11-16

申请号：US17740413

申请日：2022-05-10

Applicant: Infineon Technologies AG

Inventor： Marcus Boehm ,  Michael Fuegl ,  Ludwig Heitzer ,  Stefan Woetzel

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49506 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49568 ,  H01L21/4825 ,  H01L21/565

Abstract: A molded semiconductor package includes: a mold compound; a metal substrate partly embedded in the mold compound; at least one first metal lead partly embedded in the mold compound; an inlay embedded in the mold compound, the inlay comprising a semiconductor die embedded in an electrically insulating body, a first metal structure attached to a first side of the semiconductor die, and a second metal structure attached to a second side of the semiconductor die; and a metal clip at least partly embedded in the mold compound and connecting the second metal structure to the at least one first metal lead. The semiconductor die has a maximum junction temperature higher than a glass transition temperature of the mold compound, the electrically insulating body has a glass transition temperature at or above the maximum junction temperature of the semiconductor die, and the metal substrate is attached to the first metal structure.

公开(公告)号：US20210225744A1

公开(公告)日：2021-07-22

申请号：US17150739

申请日：2021-01-15

Applicant: Infineon Technologies AG

Inventor： Frank Singer ,  Marcus Boehm ,  Andreas Grassmann ,  Martin Gruber ,  Uwe Schindler

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.