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公开(公告)号：US20230035123A1
公开(公告)日：2023-02-02
申请号：US17875933
申请日：2022-07-28
Applicant: Infineon Technologies AG
Inventor： Stephan LEISENHEIMER , Richard HEINZ , Hans-Joerg WAGNER , Markus KAMMERSBERGER
Abstract: The present disclosure relates to a sensor chip, including a semiconductor substrate, a first sensor circuit monolithically integrated into the semiconductor substrate, at least one second sensor circuit monolithically integrated into the semiconductor substrate, wherein the first and second integrated sensor circuits are embodied identically.
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