公开(公告)号：US20170314969A1

公开(公告)日：2017-11-02

申请号：US15497296

申请日：2017-04-26

Applicant: Infineon Technologies AG

Inventor： Udo AUSSERLECHNER ,  Michael HOLLIBER

IPC: G01D5/20 ,  G01R15/20 ,  G01R19/00 ,  G01R33/00

CPC classification number: G01R33/0052 ,  G01D5/147 ,  G01R15/20 ,  G01R19/0092

Abstract: Magnetic sensor arrangement comprising a component board delimited by two opposing main surfaces and having an accommodation hole for accommodating at least part of a magnetic field generating structure, and a magnetic sensor package located at least partially between the two opposing main surfaces and configured for sensing a magnetic field generated by the magnetic field generating structure.