公开(公告)号：US20210218127A1

公开(公告)日：2021-07-15

申请号：US17248167

申请日：2021-01-12

Applicant: Infineon Technologies AG

Inventor： Thomas LAMPERSBERGER ,  Reinhard FEGER ,  Markus Josef LANG ,  Juergen MINICHSHOFER ,  Ernst SELER ,  Andreas STELZER

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q5/371 ,  H01Q21/00

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.