公开(公告)号：US20210011095A1

公开(公告)日：2021-01-14

申请号：US16923583

申请日：2020-07-08

Applicant: Infineon Technologies AG

Inventor： Gernot BINDER ,  Riccardo DAPRETTO ,  Diego LUNARDINI ,  Mario MOTZ ,  Volker STRUTZ

IPC: G01R33/00

Abstract: A sensor device comprises an electrically conductive chip carrier, wherein the chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal, a magnetic field sensor chip arranged on a mounting surface of the chip carrier, wherein the magnetic field sensor chip comprises a sensor element, wherein the shape of the auxiliary structure is embodied such that an electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a predefined precalibration magnetic field at the location of the sensor element, wherein during measurement operation of the precalibrated sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.