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公开(公告)号：US20250157869A1
公开(公告)日：2025-05-15
申请号：US18899124
申请日：2024-09-27
Applicant: Infineon Technologies AG
Inventor： Patrick SCHRÖDL , Michael BAUER , Timo BOHNENBERGER , Stefan PELTIES
Abstract: An encapsulant for an electronic package is disclosed. In one example, the encapsulant comprises at least one organic constituent, and at least one inorganic constituent. A difference between the relative dielectric constant of the at least one organic constituent and the relative dielectric constant of the at least one inorganic constituent divided by the relative dielectric constant of the at least one organic constituent has an absolute value of not more than 0.2.
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