公开(公告)号：US20150245504A1

公开(公告)日：2015-08-27

申请号：US14631368

申请日：2015-02-25

Applicant: InnoLux Corporation

Inventor： Bo ZHANG ,  Ching-I LO

IPC: H05K5/00 ,  H05K5/04

CPC classification number: H05K9/0039 ,  H05K7/1417

Abstract: An electronic apparatus includes a metallic housing, a circuit board and an adhesive. The metallic housing includes a first engaging structure. The circuit board includes a second engaging structure, which is coupled to the first engaging structure. The adhesive is disposed between the first and second engaging structures to connect the metallic housing and the circuit board. The manufacturing efficiency of the electronic apparatus can be enhanced by the adhesive connecting the metallic housing and the circuit board.

Abstract translation: 电子设备包括金属外壳，电路板和粘合剂。 金属壳体包括第一接合结构。 电路板包括耦合到第一接合结构的第二接合结构。 粘合剂设置在第一和第二接合结构之间以连接金属壳体和电路板。 可以通过连接金属外壳和电路板的粘合剂来提高电子设备的制造效率。