ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210382341A1

    公开(公告)日:2021-12-09

    申请号:US17318225

    申请日:2021-05-12

    Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a second electrode layer disposed on the second substrate; a display medium layer disposed between the first electrode layer and the second electrode layer; a sealant disposed between the first electrode layer and the second electrode layer to surround the display medium layer; and a first metal element extending along a first direction, wherein the first metal element is fixed onto the first electrode layer through a conductive glue and a first insulating glue.

    ELECTRONIC DEVICE
    2.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240053627A1

    公开(公告)日:2024-02-15

    申请号:US18384647

    申请日:2023-10-27

    Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

    ELECTRONIC DEVICE
    3.
    发明申请

    公开(公告)号:US20220276524A1

    公开(公告)日:2022-09-01

    申请号:US17664387

    申请日:2022-05-20

    Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

    ELECTRONIC DEVICE
    4.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240345428A1

    公开(公告)日:2024-10-17

    申请号:US18753191

    申请日:2024-06-25

    Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue extends along an extension direction parallel to the first edge, and along the extension direction, a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.

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