公开(公告)号：US20240319539A1

公开(公告)日：2024-09-26

申请号：US18734097

申请日：2024-06-05

Applicant: InnoLux Corporation

Inventor： Ming-Tien WANG ,  Chin-Tu TSAI ,  Chih-Hung HSU ,  Chih-Hung LIU ,  Hsiang-Yu JUAN

IPC: G02F1/13357

CPC classification number: G02F1/133608 ,  G02F1/133605

Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; a support module disposed between the back plate and the optical film; and an adhesive layer disposed between the back plate and the support module, wherein the support module includes a base and a support unit between the base and the optical film, and the base is fixed to the back plate by the adhesive layer.

公开(公告)号：US20250028110A1

公开(公告)日：2025-01-23

申请号：US18745565

申请日：2024-06-17

Applicant: InnoLux Corporation

Inventor： Yi-Cheng LAI ,  Chih-Hung LIU ,  Chih-Hung HSU ,  I-Han LIU

IPC: F21V8/00

Abstract: An electronic device is provided. The electronic device includes a substrate, a first optical film and a second optical film. The first optical film is disposed on the substrate, and the first optical film includes an engaging portion. The second optical film is disposed on the substrate and having an upper surface and a lower surface opposite to each other, and the second optical film is in mutual interference with the engaging portion of the first optical film. The engaging portion includes a first portion, a second portion and an engaging structure, and the first portion and second portion are disposed on opposite sides of the engaging structure, and one of the first portion and the second portion is disposed on the upper surface of the second optical film and the other one is disposed below the lower surface of the second optical film.

公开(公告)号：US20240004237A1

公开(公告)日：2024-01-04

申请号：US18465621

申请日：2023-09-12

Applicant: InnoLux Corporation

Inventor： Ming-Tien WANG ,  Chin-Tu TSAI ,  Chih-Hung HSU ,  Chih-Hung LIU ,  Hsiang-Yu JUAN

IPC: G02F1/13357

CPC classification number: G02F1/133608 ,  G02F1/133605

Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module comprises a base and a support unit between the base and the optical film, the base comprises a curved surface away from the back plate, the support unit is connected to an upper surface of the base, and the upper surface comprises the curved surface; wherein a hollow space is enclosed by the base.

公开(公告)号：US20220082888A1

公开(公告)日：2022-03-17

申请号：US17410456

申请日：2021-08-24

Applicant: InnoLux Corporation

Inventor： Ming-Tien WANG ,  Chin-Tu TSAI ,  Chih-Hung HSU ,  Chih-Hung LIU ,  Hsiang-Yu JUAN

IPC: G02F1/13357

Abstract: A backlight module includes: a back plate; an optical film disposed on the back plate; and a support module disposed on the back plate and between the back plate and the optical film, wherein the support module includes a base, and an elasticity coefficient of the base is greater than or equal to 0.4 kgf/mm and smaller than or equal to 0.6 kgf/mm.

公开(公告)号：US20230066479A1

公开(公告)日：2023-03-02

申请号：US17950581

申请日：2022-09-22

Applicant: InnoLux Corporation

Inventor： Ming-Tien WANG ,  Chin-Tu TSAI ,  Chih-Hung HSU ,  Chih-Hung LIU ,  Hsiang-Yu JUAN

IPC: G02F1/13357

Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module includes a base, and the base includes a hollow space and a curved surface away from the back plate.