公开(公告)号：US20230125400A1

公开(公告)日：2023-04-27

申请号：US17936545

申请日：2022-09-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Yu-Chun FU ,  Cheng-Yang TSAI

IPC: G02B1/11 ,  G02B1/14 ,  G02B1/18

Abstract: An electronic device includes an electronic module, a protective substrate on the electronic module, and a functional layer on the protective substrate. The functional layer has a hardness in a range of 4H to 9H. A manufacturing method of the electronic device comprises providing a protective substrate having a first surface and a second surface opposite to the first surface; forming a preparatory layer on the first surface; performing a heat treatment to convert the preparatory layer to a functional layer; and disposing an electronic module on the second surface, wherein the heat treatment is performed in a range of 200° C. to 1200° C.