公开(公告)号：US20250107253A1

公开(公告)日：2025-03-27

申请号：US18816264

申请日：2024-08-27

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Yu-Ting TSAI ,  I-An YAO

IPC: H01L27/144 ,  H01L25/16

Abstract: A method for manufacturing an electronic device includes the following steps: providing a carrier and a circuit substrate, wherein the carrier includes a plurality of spacers, the circuit substrate includes a plurality of electronic units, and the electronic units are detected and determined to be normal or defective; providing cover units on the carrier; disposing the circuit substrate on the cover units so that the spacers support the circuit substrate, wherein there is a gap between the circuit substrate and the cover units, and the cover units correspond to the electronic units determined to be normal; vacuuming the gap between the circuit substrate and the cover units; moving the spacers to make the cover units and the circuit substrate contact each other; and pressing the cover units and the circuit substrate to fix the cover units and the circuit substrate to each other.