公开(公告)号：US11373945B2

公开(公告)日：2022-06-28

申请号：US16899780

申请日：2020-06-12

Applicant: InnoLux Corporation

Inventor： Wei-Cheng Chu ,  Chih-Yuan Lee ,  Yun-Chih Tsai

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H05K1/11

Abstract: An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.