公开(公告)号：US20150183630A1

公开(公告)日：2015-07-02

申请号：US14158829

申请日：2014-01-19

Applicant: Innovative Micro Technology

Inventor： Benedikt ZEYEN ,  Jeffery F. SUMMERS

IPC: B81B1/00

CPC classification number: B81B1/00 ,  B32B37/0084 ,  B32B2037/1269 ,  B81B7/00 ,  B81C1/00269 ,  B81C2203/019 ,  Y10T428/13 ,  Y10T428/24851 ,  Y10T428/24975 ,  Y10T428/31536

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。

公开(公告)号：US20190382260A1

公开(公告)日：2019-12-19

申请号：US16433357

申请日：2019-06-06

Applicant: Innovative Micro Technology

Inventor： Jeffery F. SUMMERS

IPC: B81C1/00 ,  B32B7/12 ,  B32B18/00 ,  B32B37/12 ,  B81B7/00

Abstract: The invention is directed to an inexpensive method for bonding two wafers. The method uses an adhesive material disposed between two handling sheets and stamped with a plurality of through holes. The through holes are registered with the locations of devices formed on a substrate. The adhesive material is placed between to two substrates, around the devices, and cured.

公开(公告)号：US20150183200A1

公开(公告)日：2015-07-02

申请号：US14142712

申请日：2013-12-27

Applicant: Innovative Micro Technology

Inventor： Benedikt ZEYEN ,  Jeffery F. SUMMERS

IPC: B32B37/12 ,  B32B38/00 ,  B32B37/18

CPC classification number: B81B1/00 ,  B32B37/0084 ,  B32B2037/1269 ,  B81B7/00 ,  B81C1/00269 ,  B81C2203/019 ,  Y10T428/13 ,  Y10T428/24851 ,  Y10T428/24975 ,  Y10T428/31536

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。