公开(公告)号：US20180143662A1

公开(公告)日：2018-05-24

申请号：US15577214

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Ralph V. Miele ,  Amin Mohammed Godil ,  Andrew Larson ,  Shantanu D. Kulkarni ,  Dan H. Gerbus ,  Andrew C. Dausman ,  David A. Rittenhouse

IPC: G06F1/16

CPC classification number: G06F1/16 ,  G06F1/1675 ,  G06F1/1686 ,  H04N13/204

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a first housing and a structurally sensitive module. The structurally sensitive module can include a structurally sensitive component and a structurally sensitive attachment. The structurally sensitive attachment includes one or more mounting tabs to structurally isolate the structurally sensitive component from the first housing.