公开(公告)号：US12237442B2

公开(公告)日：2025-02-25

申请号：US17100595

申请日：2020-11-20

Applicant: Intel Corporation

Inventor： Ankur Agarwal ,  Priyanka Dobriyal

IPC: H01L21/56 ,  H01L23/31 ,  H01L33/26 ,  H01L33/40 ,  H01L33/48

Abstract: Embodiments disclosed herein include electronic packages with vents to prevent pressure buildup below a die. In an embodiment, an electronic package comprises a package substrate and a die attached to the package substrate by interconnects. In an embodiment, an underfill is under the die and surrounds the interconnects. In an embodiment, a void is provided in the underfill, and a vent is in the underfill. In an embodiment, the vent is fluidically coupled to the void and extends to an edge of the underfill.