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公开(公告)号:US12237442B2
公开(公告)日:2025-02-25
申请号:US17100595
申请日:2020-11-20
Applicant: Intel Corporation
Inventor: Ankur Agarwal , Priyanka Dobriyal
Abstract: Embodiments disclosed herein include electronic packages with vents to prevent pressure buildup below a die. In an embodiment, an electronic package comprises a package substrate and a die attached to the package substrate by interconnects. In an embodiment, an underfill is under the die and surrounds the interconnects. In an embodiment, a void is provided in the underfill, and a vent is in the underfill. In an embodiment, the vent is fluidically coupled to the void and extends to an edge of the underfill.