公开(公告)号：US20170187133A1

公开(公告)日：2017-06-29

申请号：US14757972

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Anne M. SEPIC ,  Zhen ZHOU ,  Evan M. FLEDELL

IPC: H01R12/70 ,  H05K3/30

CPC classification number: H05K7/1069 ,  G01R1/0466 ,  H01R12/7076 ,  H01R12/7082 ,  H01R23/6806 ,  H05K1/181 ,  H05K3/301 ,  H05K7/1023 ,  H05K7/1038 ,  H05K7/1061 ,  H05K2201/10325 ,  H05K2201/2018

Abstract: Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.