公开(公告)号：US20250008711A1

公开(公告)日：2025-01-02

申请号：US18344934

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha PAAVOLA ,  Curtis KOEPSELL ,  Sami HEINISUO ,  Kari MANSUKOSKI ,  Jeff KU

IPC: H05K9/00 ,  H05K1/02

Abstract: An electronic device and method for assembling an electronic device. The device includes a shielding structure at least partially, laterally surrounding an electrical component on a circuit board. The device further includes a lid affixed to the top of the shielding structure and covering the electrical component, a spring directly or indirectly applying a load force to the electronic component, and a fastener affixing the lid and the spring to the circuit board.