公开(公告)号：US20250112106A1

公开(公告)日：2025-04-03

申请号：US18375337

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Tarek Gebrael ,  Darshan Ravoori ,  Matthew Magnavita ,  Aastha Uppal ,  Xiao Lu

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10

Abstract: An integrated circuit (IC) device includes a device substrate with front- and backside IC dies and an integrated heat spreader over the backside die. The heat spreader and the backside die may be coupled to the backside of the device substrate within an array of contacts. The backside heat spreader may include a mask layer over a thermally conductive layer. The IC device may include or be coupled to second substrate (such as a motherboard). The backside heat spreader may be thermally coupled to a heat spreader or heat sink by vias through the second substrate. The backside heat spreader may enclose the backside IC die in an electrically conductive cage.