公开(公告)号：US11327050B2

公开(公告)日：2022-05-10

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/44 ,  G01N29/14

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.

公开(公告)号：US20190257793A1

公开(公告)日：2019-08-22

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/14 ,  G01N29/44

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.