公开(公告)号：US20240395655A1

公开(公告)日：2024-11-28

申请号：US18324640

申请日：2023-05-26

Applicant: Intel Corporation

Inventor： Avi Tsarfati ,  David T. O’Sullivan ,  Vishnu Prasad ,  Thomas Wagner ,  Aruna Manoharan

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: In one embodiment, an integrated circuit package includes a package substrate, a first integrated circuit die electrically coupled to the package substrate via wire bond connectors, and a second integrated circuit die coupled to the package substrate. The package further includes a heat spreader coupled to the first integrated circuit die via a thermal interface material (TIM) and a dielectric material encompassing the first integrated circuit die and the second integrated circuit die on the package substrate. A top surface of the heat spreader is aligned with a top surface of the dielectric material.