公开(公告)号：US20230194778A1

公开(公告)日：2023-06-22

申请号：US17559858

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Dowon KIM ,  Suohai MEI ,  Jason M. GAMBA ,  Sanka GANESAN

IPC: G02B6/12 ,  G02B6/13

CPC classification number: G02B6/12004 ,  G02B6/13

Abstract: Embodiments herein relate to systems, apparatuses, or processes for creating an integrated photonics package that includes a photonics IC, an electronic IC, and an optical coupling connector that are molded within a single package. In embodiments, caps may be used to protect optical components during manufacture. Other embodiments may be described and/or claimed.