公开(公告)号：US20230207424A1

公开(公告)日：2023-06-29

申请号：US18145231

申请日：2022-12-22

Applicant: Intel Corporation

Inventor： Linghe Sui ,  Jun Liu ,  Jiancheng Tao ,  Tao Wang ,  Chunlin Bai ,  Hongjun She ,  Dengfeng Huang

IPC: H01L23/427 ,  H01L25/18

CPC classification number: H01L23/427 ,  H01L25/18

Abstract: A vapor chamber architecture for multiple cavity/heat source system designs. The vapor chamber architecture can be customized in dimensions to cool two or more spatially separated, and potentially heterogeneous, heat sources in a system floor plan. The vapor chamber architecture can additionally be customized to concurrently manage the cooling requirements for the two or more heat sources that have different power consumptions and sizes. The provided vapor chamber architecture can be manufactured using etching processes, additive manufacturing processes, or the like.