公开(公告)号：US20160247756A1

公开(公告)日：2016-08-25

申请号：US14979304

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Hongqi Li ,  Gowrisankar Damarla ,  Roger Lindsay ,  Zailong Bian ,  Jin Lu ,  Shyam Ramalingam ,  Prasanna Srinivasan

IPC: H01L23/528 ,  H01L27/115

CPC classification number: H01L23/528 ,  H01L27/11524 ,  H01L27/11529 ,  H01L27/11556

Abstract: A three dimensional or stacked circuit device includes a conductive channel cap on a conductor channel. The channel cap can be created via selective deposition or other process to prevent polishing down the conductive material to isolate the contacts. The conductor channel extends through a deck of multiple tiers of circuit elements that are activated via a gate. The gate is activated by electrical potential in the conductor channel. The conductive cap on the conductor channel can electrically connect the conductor channel to a bitline or other signal line, and/or to another deck of multiple circuit elements.

Abstract translation: 三维或堆叠电路器件包括在导体通道上的导电通道盖。 可以通过选择性沉积或其它工艺来产生通道盖，以防止抛光导电材料以隔离触点。 导体通道延伸穿过通过门激活的多层电路元件。 门通过导体通道中的电位激活。 导体通道上的导电盖可以将导体通道电连接到位线或其他信号线，和/或电连接到多个电路元件的另一层。

公开(公告)号：US10319678B2

公开(公告)日：2019-06-11

申请号：US14979304

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Hongqi Li ,  Gowrisankar Damarla ,  Roger Lindsay ,  Zailong Bian ,  Jin Lu ,  Shyam Ramalingam ,  Prasanna Srinivasan

IPC: H01L23/528 ,  H01L27/115 ,  H01L27/11529 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11568 ,  H01L27/11582 ,  H01L27/06 ,  H01L27/11578 ,  H01L27/1157

Abstract: A three dimensional or stacked circuit device includes a conductive channel cap on a conductor channel. The channel cap can be created via selective deposition or other process to prevent polishing down the conductive material to isolate the contacts. The conductor channel extends through a deck of multiple tiers of circuit elements that are activated via a gate. The gate is activated by electrical potential in the conductor channel. The conductive cap on the conductor channel can electrically connect the conductor channel to a bitline or other signal line, and/or to another deck of multiple circuit elements.