公开(公告)号：US20210280518A1

公开(公告)日：2021-09-09

申请号：US16810192

申请日：2020-03-05

Applicant: Intel Corporation

Inventor： Jianyong XIE ,  Sujit SHARAN ,  Huang-Ta CHEN

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18 ,  H01L23/64

Abstract: Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.

公开(公告)号：US20250125268A1

公开(公告)日：2025-04-17

申请号：US19000015

申请日：2024-12-23

Applicant: Intel Corporation

Inventor： Jianyong XIE ,  Sujit SHARAN ,  Huang-Ta CHEN

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/64 ,  H01L25/18

Abstract: Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.