公开(公告)号：US10678524B2

公开(公告)日：2020-06-09

申请号：US15922059

申请日：2018-03-15

Applicant: Intel Corporation

Inventor： Satish K. Guggilla ,  Prasad Battini ,  Dmitry Budanov ,  John Ng

IPC: G06F8/41 ,  G06F16/22

Abstract: An embodiment of a semiconductor package apparatus may include technology to identify a field of a data structure as a candidate for a size reduction, perform a runtime analysis on the field, and reduce the size of the field based on the runtime analysis. Other embodiments are disclosed and claimed.

公开(公告)号：US20190042220A1

公开(公告)日：2019-02-07

申请号：US15922059

申请日：2018-03-15

Applicant: Intel Corporation

Inventor： Satish K. Guggilla ,  Prasad Battini ,  Dmitry Budanov ,  John Ng

IPC: G06F8/41 ,  G06F17/30

CPC classification number: G06F8/4434 ,  G06F16/2272

Abstract: An embodiment of a semiconductor package apparatus may include technology to identify a field of a data structure as a candidate for a size reduction, perform a runtime analysis on the field, and reduce the size of the field based on the runtime analysis. Other embodiments are disclosed and claimed.