公开(公告)号：US11259399B2

公开(公告)日：2022-02-22

申请号：US15901660

申请日：2018-02-21

Applicant: Intel Corporation

Inventor： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC: H01L23/367 ,  H05K1/02 ,  H01L23/498 ,  H01L23/42 ,  H01L23/373 ,  G01R1/04

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.

公开(公告)号：US20190045619A1

公开(公告)日：2019-02-07

申请号：US15901660

申请日：2018-02-21

Applicant: Intel Corporation

Inventor： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.