公开(公告)号：US20230113084A1

公开(公告)日：2023-04-13

申请号：US17498001

申请日：2021-10-11

Applicant: Intel Corporation

Inventor： Jackson Chung Peng KONG ,  Bok Eng CHEAH ,  Kok Hou TEH ,  Kooi Chi OOI ,  Li Wern CHEW

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00

Abstract: The present disclosure generally relates to a printed circuit board assembly that may include a circuit board having a first surface and an opposing second surface. The printed circuit board assembly may also include a first interconnect barrel disposed in the circuit board. The first interconnect barrel may have a first length extending between the first surface and the second surface. The first interconnect barrel may include a first section, and may further include a second section spaced apart from the first section by a first gap having a first depth extending partially through the first length. The printed circuit board assembly may further include a first conductive trace coupled to the first section and a second conductive trace coupled to the second section at a first terminal.