公开(公告)号：US20190205716A1

公开(公告)日：2019-07-04

申请号：US16235946

申请日：2018-12-28

Applicant: Intel Corporation

Inventor： Ariel Moshkovitz ,  Oren Arad ,  Tomer Rider ,  Tamara Gaidar ,  Oleg Pogorelik

IPC: G06K19/073 ,  H04L29/06 ,  A61J3/00 ,  A61J1/03

CPC classification number: G06K19/07354 ,  A61J1/035 ,  A61J3/007 ,  A61J2200/70 ,  A61J2205/60 ,  H04L63/0861

Abstract: Technologies are described for delivering an active agent using an ingestible pill device, securing medication package content, and monitoring the medication package content. Examples of the technology include using an ingestible pill device to deliver an active agent, where release of the active agent can be based on patient authentication, analyzing sensor data to determine a condition for releasing the active agent, analyzing image data to identify a release point, etc. Examples of the technology also include using a monitoring device to secure a medication package using a cover and locking device, monitoring the medication package to detect access to the medication package, and tracking access to the medication package to determine medication adherence.

公开(公告)号：US10943163B2

公开(公告)日：2021-03-09

申请号：US16235946

申请日：2018-12-28

Applicant: Intel Corporation

Inventor： Ariel Moshkovitz ,  Oren Arad ,  Tomer Rider ,  Tamara Gaidar ,  Oleg Pogorelik

IPC: G06K19/073 ,  H04L29/06 ,  A61J1/03 ,  A61J3/00 ,  G01N21/90 ,  A61J7/04 ,  A61M31/00

Abstract: Technologies are described for delivering an active agent using an ingestible pill device, securing medication package content, and monitoring the medication package content. Examples of the technology include using an ingestible pill device to deliver an active agent, where release of the active agent can be based on patient authentication, analyzing sensor data to determine a condition for releasing the active agent, analyzing image data to identify a release point, etc. Examples of the technology also include using a monitoring device to secure a medication package using a cover and locking device, monitoring the medication package to detect access to the medication package, and tracking access to the medication package to determine medication adherence.

公开(公告)号：US20190115011A1

公开(公告)日：2019-04-18

申请号：US15786803

申请日：2017-10-18

Applicant: Intel Corporation

Inventor： Muhammad Khellah ,  Oren Arad ,  Binuraj Ravindran ,  Somnath Paul ,  Charles Augustine ,  Bruno Umbria Pedroni

IPC: G10L15/02 ,  G10L25/30 ,  G10L15/06 ,  G06N3/04

CPC classification number: G10L15/02 ,  G06N3/049 ,  G10L15/063 ,  G10L15/16 ,  G10L25/12 ,  G10L25/24 ,  G10L25/30 ,  G10L2015/0635 ,  G10L2015/088

Abstract: An example apparatus for detecting keywords in audio includes an audio receiver to receive audio comprising a keyword to be detected. The apparatus also includes a spike transducer to convert the audio into a plurality of spikes. The apparatus further includes a spiking neural network to receive one or more of the spikes and generate a spike corresponding to a detected keyword.

公开(公告)号：US10403266B2

公开(公告)日：2019-09-03

申请号：US15786803

申请日：2017-10-18

Applicant: Intel Corporation

Inventor： Muhammad Khellah ,  Oren Arad ,  Binuraj Ravindran ,  Somnath Paul ,  Charles Augustine ,  Bruno Umbria Pedroni

IPC: G10L15/16 ,  G10L15/02 ,  G10L25/30 ,  G06N3/04 ,  G10L15/06

Abstract: An example apparatus for detecting keywords in audio includes an audio receiver to receive audio comprising a keyword to be detected. The apparatus also includes a spike transducer to convert the audio into a plurality of spikes. The apparatus further includes a spiking neural network to receive one or more of the spikes and generate a spike corresponding to a detected keyword.

公开(公告)号：US10304769B2

公开(公告)日：2019-05-28

申请号：US15748106

申请日：2015-08-27

Applicant: INTEL CORPORATION

Inventor： Robert L. Sankman ,  Allan A. Ovrom, III ,  Robert Starkston ,  Oren Arad

IPC: H01L23/52 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

Abstract: Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed.