公开(公告)号：US20220109446A1

公开(公告)日：2022-04-07

申请号：US17555253

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Paul Rotker ,  Lai Guan Tang ,  Luis Hau ,  Ilya Ganusov

IPC: H03K19/0175

Abstract: An integrated circuit includes a region of logic circuits, first and second selector circuits, a first interface circuit for exchanging information with a first type of device according to a first communication protocol, and a second interface circuit for exchanging information with a second type of device according to a second communication protocol. The first selector circuit is configurable to provide signals between the region of the logic circuits and a selected one of the first or second interface circuits. The second selector circuit is configurable to provide signals between the selected one of the first or second interface circuits and the first or second type of device.

公开(公告)号：US20190319627A1

公开(公告)日：2019-10-17

申请号：US16456491

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Jeffrey Chromczak ,  Paul Rotker

IPC: H03K19/177 ,  H01L23/00 ,  H01L25/065 ,  H01L27/02

Abstract: An integrated circuit device is disclosed that includes an interposer and a programmable fabric die disposed on the interposer. The programmable fabric die includes multiple sectors that each have multiple rows of logic element blocks. Each row of logic element blocks includes multiple microbumps. Each logic element block has programmable fabric circuitry and an input/output interface electrically coupled to a respective microbump. The integrated circuit device also includes a device disposed on the interposer external to the programmable fabric die and electrically coupled to the microbumps via the interposer.