公开(公告)号：US20190181080A1

公开(公告)日：2019-06-13

申请号：US16326688

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Khang Choong YONG ,  Po Yin YAW ,  Kok Hou TEH

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/64 ,  H01L25/065 ,  H01L25/10

Abstract: Semiconductor package assemblies and semiconductor packages incorporating an impedance-boosting channel between a transmitter die and a receiver die are described. In an example, a semiconductor package includes a package substrate incorporating the impedance-boosting channel having a first arc segment connected to the transmitter die and a second arc segment connected to the receiver die. The arc segments extend around respective vertical axes passing through a transmitter die electrical bump and a receiver die electrical bump, respectively. Accordingly, the arc segments introduce an inductive circuitry to increase signal integrity of an electrical signal sent from the transmitter die to the receiver die.