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公开(公告)号:US20220207750A1
公开(公告)日:2022-06-30
申请号:US17572517
申请日:2022-01-10
Applicant: Intel Corporation
Inventor: Yuming LI , Zhen ZHOU , Xiaodong WANG , Quan YIN
Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.