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公开(公告)号:US11450009B2
公开(公告)日:2022-09-20
申请号:US16957401
申请日:2018-02-26
Applicant: Intel Corporation
Inventor: Yuming Li , Zhen Zhou , Xiaodong Wang , Quan Yin
Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.
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公开(公告)号:US12142032B2
公开(公告)日:2024-11-12
申请号:US17572517
申请日:2022-01-10
Applicant: Intel Corporation
Inventor: Yuming Li , Zhen Zhou , Xiaodong Wang , Quan Yin
Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.
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公开(公告)号:US20210217179A1
公开(公告)日:2021-07-15
申请号:US16957401
申请日:2018-02-26
Applicant: Intel Corporation
Inventor: Yuming Li , Zhen Zhou , Xiaodong Wang , Quan Yin
Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.
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