公开(公告)号：US20220285288A1

公开(公告)日：2022-09-08

申请号：US17192770

申请日：2021-03-04

申请人： Intel Corporation

发明人： Valery Ouvarov-Bancalero ,  John Harper ,  Malavarayan Sankarasubramanian ,  Patrick Nardi ,  Bamidele Daniel Falola ,  Ravi Siddappa ,  James Mertens

IPC分类号： H01L23/00 ,  H01L23/06 ,  H05K7/14

摘要： A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.