公开(公告)号：US20200185806A1

公开(公告)日：2020-06-11

申请号：US16213181

申请日：2018-12-07

Applicant: Intel Corporation

Inventor： Shallu Bhalla ,  Daniel Cox ,  Bhagyashree S. Ganore ,  Jesse Melhorn ,  Richard Perry ,  Srinath Reddy Yerakondappagari

IPC: H01Q1/02 ,  H01Q1/32

Abstract: Techniques are disclosed to remedy thermal issues associated with antenna systems. These techniques include implementing heat pipes coupled between an external mast having antenna circuitry mounted thereon and an internal heatsink inside an environmentally-controlled location. This configuration thermally regulates heat associated with active antennas mounted to the mast, which is externally mounted onto the roof of a vehicle. The heat pipes carry heat from the mast down through the roof to the internal heatsink. The aspects described herein allow for car manufacturers to integrate mmWave technology into their vehicles while avoiding large and unsightly cooling mechanisms that would otherwise adversely impact aerodynamics and fuel efficiency.

公开(公告)号：US12249793B2

公开(公告)日：2025-03-11

申请号：US17559688

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Richard Perry ,  Robert Schum ,  Mythili Hegde

IPC: H01R13/64 ,  H01R12/72 ,  H01R12/73 ,  H01R13/03 ,  H01R13/04 ,  H01R13/10

Abstract: Disclosed embodiments include a modified M.2 interface that is configured to allow an increased current capacity on power-carrying pins. The power-carrying pins are implemented using an alloy that can sustain current levels in excess of those specified in the M.2 standard while remaining within M.2 standard specified temperature limits. Sockets and corresponding cards in embodiments are modified so that a card requiring the higher current capacity cannot fit into a legacy M.2 standard socket, while a legacy M.2 card can fit into a modified high current M.2 socket. Other embodiments may be described and/or claimed.

公开(公告)号：US10938084B2

公开(公告)日：2021-03-02

申请号：US16213181

申请日：2018-12-07

Applicant: Intel Corporation

Inventor： Shallu Bhalla ,  Daniel Cox ,  Bhagyashree S. Ganore ,  Jesse Melhorn ,  Richard Perry ,  Srinath Reddy Yerakondappagari

IPC: H01Q1/32 ,  H01Q1/02

Abstract: Techniques are disclosed to remedy thermal issues associated with antenna systems. These techniques include implementing heat pipes coupled between an external mast having antenna circuitry mounted thereon and an internal heatsink inside an environmentally-controlled location. This configuration thermally regulates heat associated with active antennas mounted to the mast, which is externally mounted onto the roof of a vehicle. The heat pipes carry heat from the mast down through the roof to the internal heatsink. The aspects described herein allow for car manufacturers to integrate mmWave technology into their vehicles while avoiding large and unsightly cooling mechanisms that would otherwise adversely impact aerodynamics and fuel efficiency.

公开(公告)号：US20230092528A1

公开(公告)日：2023-03-23

申请号：US17474470

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Richard Perry ,  Robert Schum

IPC: H01R9/05

Abstract: An ultra-low profile coaxial cable connector (i.e. plug) is provided that implements a lateral coupling of a coaxial cable inner conductor and center pin of a mating PCB-mounted coaxial receptacle. The overall height of a mating coaxial receptacle center pin is also reduced by way of a cutout in the receptacle ground ring as well as a cutout in a mating outer shell of the coaxial cable connector. The ultra-low profile coaxial cable connector achieves a reduction in mated height of less than 1.0 mm for both 1.13 mm diameter and 0.81 mm diameter coaxial cables. In both cases, the coaxial cable connector designs as discussed herein enable a further reduction in the total thickness of communication module boards to 1.25 mm, thereby meeting the high demands for thinner electronic device designs.

公开(公告)号：US20220166166A1

公开(公告)日：2022-05-26

申请号：US17559688

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Richard Perry ,  Robert Schum ,  Mythili Hegde

IPC: H01R13/64 ,  H01R12/72 ,  H01R13/10 ,  H01R13/04 ,  H01R13/03

Abstract: Disclosed embodiments include a modified M.2 interface that is configured to allow an increased current capacity on power-carrying pins. The power-carrying pins are implemented using an alloy that can sustain current levels in excess of those specified in the M.2 standard while remaining within M.2 standard specified temperature limits. Sockets and corresponding cards in embodiments are modified so that a card requiring the higher current capacity cannot fit into a legacy M.2 standard socket, while a legacy M.2 card can fit into a modified high current M.2 socket. Other embodiments may be described and/or claimed.

公开(公告)号：US20190260110A1

公开(公告)日：2019-08-22

申请号：US15939139

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Trang Thai ,  Raanan Sover ,  Noam Kogan ,  Jonathan Jensen ,  Richard Perry ,  William James Lambert ,  Omer Asaf ,  Ralph Winzenburg ,  Daniel R. Cox ,  Josef Hagn ,  Sidharth Dalmia

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.